Products
Cavity Boards
Cavity Boards allow chips or components to be installed as if embedded into the board.
By inserting the chip into the cavity, the package can be made smaller.
Construction example
- *Please inquire regarding details.
Characteristics
- Made to conform to customer’s assembly methods.
- Cavity area tolerance is within +/-75um or less
- Capable of making smaller and thinner modules.
- Can be used in place of component embedded boards.
Conductor Specifications
| Category | Contents |
|---|---|
| Layers | 4 Layer - 9 Layer boards |
| Overall thickness | 0.3mm~0.8mm |
| Line / Space | Min.50μm/50μm |
| Laser Via / Land | Min.80μm/200μm |
| Core | High Tg material |
| Cavity Depth | 0.15mm~0.45mm |
| Cavity Opening | 1.0mm-7.0mm square |
| Cavity accuracy | +/- 75μm |
Additionally, we have manufacturing experiences according to various specs. Feel free to ask us directly regarding any inquiry.
