Products
Products
We produce high density highly reliable semi-conductor package substrates for image processing systems, memory systems, communications systems, application processors, etc.

| Application | Rigid Construction Substrates | Build-up Construction Substrates | Core-less Technology | UNaFI | Magic-Regin Carrier |
|---|---|---|---|---|---|
| Image processing | ○ | ○ | |||
| Memory | ○ | ○ | ○ | ||
| Power devices | ○ | ○ | |||
| RF | ○ | ○ | ○ | ||
| Baseband | ○ | ||||
| Automotive | ○ | ○ | |||
| Application processor | ○ | ○ | |||
| Fingerprint sensor | ○ |