"JPCA Show 2011" Exhibition
April 25, 2011
Daisho Denshi Co., Ltd. will exhibit at "JPCA Show 2011" on June 1, 2011.
We are looking forward to seeing you there.
| Outline of JPCA Show 2011 | |
|---|---|
| Name | 41st International Electronic Circuits Exhibition (JPCA Show 2011) |
| Title | 2011 IC packaging EXPO/ Device Embedded EXPO Module Japan 2011 |
| Place | TOKYO BIG SITE |
| Opening Dates | June 1(Wed) to June 3(Fri), 2011 |
| Opening Hours | 10:00 a.m.to 5:00 p.m. |
| Booth No | 4E-09 |
| Exhibit products | Semiconductor package board： High density Build-up/Semi-additive/Cavity structures Flex-rigid board： Ultrathin build up specification/ Sequential layers High density board for module： Filled via full stack specification Build-up boards Board assembly support jigs： Magic Resin carrier (Transfer carrier without adhered tape) Laser metal mask and more PWB design/Simulation： Proposal of substrate design with high perfection simulation Also available at single simulating operation |
| Contact at | Committee member for JPCA Show the person in charge：SATO TEL ： +81-3-3722-2151 E-mail ： sato@wind.daisho-denshi.co.jp |
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For more detail information for JPCA Show 2011,
please visit at JPCA homepage
