"JPCA Show 2012" Exhibition
May 25, 2012
Daisho Denshi Co., Ltd. will exhibit at "JPCA Show 2012" on June 13, 2012.We are looking forward to seeing you there.
| Outline of JPCA Show 2012 | |
|---|---|
| Name | 42st International Electronic Circuits Exhibition (JPCA Show 2012) |
| Title | 2012 IC packaging EXPO/ Device Embedded EXPO Module Japan 2012 |
| Place | TOKYO BIG SITE |
| Opening Dates | June 13(Wed) to June 15(Fri), 2012 |
| Opening Hours | 10:00 a.m.to 5:00 p.m. |
| Booth No | 6B-45 |
| Exhibit products | Semiconductor package board： High density Build-up/Semi-additive/Cavity structures Flex-rigid board： Ultrathin build up specification/ Sequential layers High density board for module： Filled via full stack specification Build-up boards Board assembly support jigs： Magic Resin carrier (Transfer carrier without adhered tape) Laser metal mask and more PWB design/Simulation： Proposal of substrate design with high perfection simulation Also available at single simulating operation |
| Contact at | Committee member for JPCA Show the person in charge：SATO TEL ： +81-3-3722-2151 E-mail ： sato@wind.daisho-denshi.co.jp |
 2011's Booth Photo |
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For more detail information for JPCA Show 2012,
please visit at JPCA homepage
