Products
Build-UP Boards (for modules)
These are high density build-up boards with filled stacked vias on each layer.
Our lamination process promises even layer spacing,
along with consistent conductor thickness for better impedance control,
and stability especially with high-speed signals.
Construction examples
-
6 Layer, filled stacked via build-up
-
6 Layer coreless ultra-thin Build-up
Characteristics
- Utilizes ultra-thin core material and pre-preg material from various makers.
- Utilizes high-Tg material, low elasticity material.
- Narrow-pitch via spacing for high-speed circuits.
- Flatter component lands on the surface to aid assembly.
Uses
Various modules and device boards, etc.Conductor Specifications
| Construction | Build-up | Coreless Build-up | ||
|---|---|---|---|---|
| Layer count | 4Layer | 6Layer | 4Layer | 6Layer |
| Overall thickness | 160μm | 225μm | 140μm | 200μm |
| Total thickness | Min. 40μm / 40μm | |||
|
Via/Land (outer layers) |
Min. 60μm / 90μm | Min. 60μm / 110μm | ||
|
Via/Land (inner layers) |
Min. 60μm / 110μm | Min. 80μm / 110μm | ||
| Laser via pitch | 150μm | 180μm | ||
Additionally, we have manufacturing experiences according to various specs. Feel free to ask us directly regarding any inquiry.
