Build-UP Boards (for modules)
These are high density build-up boards with filled stacked vias on each layer.
Our lamination process promises even layer spacing,
along with consistent conductor thickness for better impedance control,
and stability especially with high-speed signals.
- Utilizes ultra-thin core material and pre-preg material from various makers.
- Utilizes high-Tg material, low elasticity material.
- Narrow-pitch via spacing for high-speed circuits.
- Flatter component lands on the surface to aid assembly.
Uses Various modules and device boards, etc.
||Min. 40μm / 40μm
|Min. 60μm / 90μm
||Min. 60μm / 110μm
|Min. 60μm / 110μm
||Min. 80μm / 110μm
|Laser via pitch